| 1 |
專利 |
具有金屬柱之晶片及具有金屬柱之晶片之封裝結構 /專利號碼：I478303B /國別：中華民國 |
| 2 |
專利 |
半導體封裝構造用載板及其製造方法 /專利號碼：I405312B /國別：中華民國 |
| 3 |
專利 |
Separation apparatuses and methods for separating glass sheets from glass ribbons /專利號碼：20140138421A1 /國別：USA |
| 4 |
專利 |
具有金属柱的芯片及具有金属柱的芯片的封装结构 /專利號碼：102064135B /國別：中國 |
| 5 |
期刊論文 |
Meng-Kai Shih, Chih-Yi Huang, Tsan-Hsien Chen, Chen-Chao Wang, David Tarng and CP Hung, “Electrical Thermal and Mechanical Characterization of eWLB, Fully-Molded Fan-Out Package and Fan-Out Chip Last Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Early Access, 2019（IF=1.86, SCI） |
| 6 |
期刊論文 |
M. Y. Tsai, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, Early Access, 2019（IF=1.583, SCI） |
| 7 |
期刊論文 |
Y.-S. Lai, M.-K. Shih, C.-C. Lee and T. H. Wang, “Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages,” Microelectronics Reliability, 52(11): 2851-2855, 2012（IF=1.483, SCI） |
| 8 |
期刊論文 |
H.-Y. Chang, W.-F. Pan, M.-K. Shih and Y.-S. Lai. Geometric design for ultra-long needle probe card for digital light processing wafer testing. Microelectronics Reliability, 50(4): 556-563, 2010. Invited paper to the special issue on advances in wafer level packaging (WLP). （IF=1.483, SCI） |
| 9 |
期刊論文 |
A. T. Wu, C.-Y. Tsai, C.-L. Kao, M.-K. Shih, Y.-S. Lai, H.-Y. Lee and C.-S. Ku, “In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation x-rays,” Journal of Electronic Materials, 38(11): 2308-2313, 2009. （IF=1676, SCI） |
| 10 |
期刊論文 |
M.-K. Shih and Y.-S. Lai, “Design optimization of needle geometry for wafer-level probing test,” IEEE Transactions on Components and Packaging Technologies, 32(2): 435-439, 2009. （IF=1.276, SCI） |
| 11 |
期刊論文 |
D. S. Liu and M. K. Shih, “Application of a genetic algorithm to the design optimization of a multilayer probe card for wafer level testing ”, IEEE Transactions on Electronics Packaging Manufacturing, v 32, n 1, p 49-58, 2009（IF=1.336, SCI） |
| 12 |
期刊論文 |
D.S. Liu and M.K. Shih, “An Experimental and Numerical Investigation Into Multilayer Probe Card Layout Design,” IEEE Transactions on Electronics Packaging Manufacturing, v29, issue:3, p 163-171, 2006. （IF=1.336, SCI） |
| 13 |
期刊論文 |
D.S. Liu and M.K. Shih, “Experimental method and FE simulation model for evaluation of wafer probing parameters,” Microelectronics Journal, v37, issue:9, p 871-883, 2006.（IF=1.284, SCI） |
| 14 |
期刊論文 |
D. S. Liu, M. K. Shih and S. M. Liu, “EXPERIMENTAL AIDED PERFORMANCE EVALUATION METHODS FOR WAFER PROBE TEST”, EXPERIMENTAL TECHNIQUES, Vol. 30, Issue 5, PP. 23-27, 2006.（IF=0.779, SCI） |
| 15 |
期刊論文 |
D. S. Liu, M. K. Shih and W. H. Huang, “Measurement and Analysis of Wafer Probe Testing Contact Resistance”, Microelectronics Reliability, Vol. 47, Issue 7, PP. 1086-1094, 2006. （IF=1.483, SCI） |
| 16 |
研討會論文 |
Dao-Long Chen ; Ian Hu ; KarenYU Chen ; Meng-Kai Shih ; David Tarng ; Dinos Huang ; JY On, “Material and Structure Design Optimization for Panel-Level Fan-Out Packaging,” IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, USA, 2019. |
| 17 |
研討會論文 |
Chan-Yuan Liu ; Jason Chien ; Yu-Chou Tseng ; Kuo-Hsien Liao ; Alex Chan ; Dao-Long Chen ; Meng-Kai Shih ; Mark Gerber, “Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding,” IEEE 69th Electronic Components and Technology Conference (ECTC) , Las Vegas, USA, 2019. |
| 18 |
研討會論文 |
Huang Hung-Hsien ; Cheng-Yu Tsai ; Jung-Che Tsai ; Meng-Kai Shih ; David Tang ; CP Hung, “From Package to System Thermal Characterization and Design of High Power 2.5-D IC,” International Conference on Electronics Packaging (ICEP), Niigata, Japan, 2019. |
| 19 |
研討會論文 |
Meng-Kai Shih ; Ryan Chen ; PeterBS Chen ; Ying-Chih Lee ; KarenYU Chen ; Ian Hu ; Tang-Yuan Chen ; Lung Tsai ; Eatice Chen ; Eddie Tsai ; David Tarng ; CP Hung, “Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-Out Chip Last Packages,” IEEE 68th Electronic Components and Technology Conference (ECTC) , San Diego, USA, 2018. |
| 20 |
研討會論文 |
Dao-Long Chen ; Po-Hsien Sung ; Wei-Jie Yin ; Meng-Kai Shih ; David Tarng ; Chih-Pin Hung, “Mechanical characterization comparison as flip-chip package to fan-out package,” International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Mie, Japan, 2018. |
