| 1 |
研討會論文 |
施孟鎧、李長祺、賴逸少：「40 nm ILD 在熱製程中之可靠度評估分析」，第三十四屆全國力學會議論文集，G1009，國立雲林科技大學，雲林縣, 2010。 |
2022-01-01 |
| 2 |
研討會論文 |
Y.-S. Lai, M.-K. Shih, C.-C. Lee, T. H. Wang, B. K. Appelt and C. Cheung, “Structural design guideline for minimizing extreme low-k delamination potential in flip-chip packages with 40 nm wafer node,” In Proceedings of ICEP (11th International Conference on Electronics Packaging), pp. 172-176, Nara, Japan, 2011. |
2022-01-01 |
| 3 |
研討會論文 |
Meng Kai Shih ; Ping Chi Hong, “Structural design guideline for Cu pillar bump reliability in system in packages module,” IEEE 17th Electronics Packaging and Technology Conference (EPTC), Singapore, 2015 |
2022-01-01 |
| 4 |
研討會論文 |
Tang-Yuan Chen ; Bo-Syun Chen ; Penny Yang ; Jin-Yuan Lai ; Meng-Kai Shih, “The warpage and thermal simulation study for embedded die technology,” IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, 2016 |
2022-01-01 |
| 5 |
研討會論文 |
Wu-Sung Yao ; Ian Hu ; Golden Kao ; Meng-Kai Shih ; Karen Chen, “Dynamic stiffness analysis of repetitive control and applied to Advanced Metrology Analyzer,” 17th International Conference on Electronic Packaging Technology (ICEPT) ,Wuhan, China, 2016 |
2022-01-01 |
| 6 |
研討會論文 |
Chang-Chi Lee ; CP ung ; Calvin Cheung ; Ping-Feng Yang ; Chin-Li Kao ; Dao-Long Chen ; Meng-Kai Shih ; Chien-Lin Chang Chien ; Yu-Hsiang Hsiao ; Li-Chieh Chen ; Michael Su ; Michael Alfano ; Joe Siegel ; Julius Din ; Bryan Black, “An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer,” IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, USA, 2016 |
2022-01-01 |
| 7 |
研討會論文 |
Meng-Kai Shih ; Charles Hsu ; Yungshun Chang ; Karenyu Chen ; Ian Hu ; Teck Lee ; David Tarng; CP Hung, “Warpage Characterization of Glass Interposer Package Development,” IEEE 67th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, USA, 2017 |
2022-01-01 |
| 8 |
研討會論文 |
Jin-Yuan Lai ; Tang-Yuan Chen ; Ming-Han Wang ; Meng-Kai Shih ; David Tarng ; Chih-Pin Hung, “Characterization of Dual Side Molding SiP Module,” IEEE 67th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, USA, 2017 |
2022-01-01 |
| 9 |
研討會論文 |
Meng-Kai Shih ; Ying-Chih Lee ; Ryan Chen ; David Tarng ; CP Hung, “Parameters study of thermomechanical reliability of board-level fan-out package,” International Conference on Electronics Packaging (ICEP), Yamagata, Japan, 2017 |
2022-01-01 |
| 10 |
研討會論文 |
Meng-Kai Shih ; Hsin-Chih Shih ; Ying-Chih Lee ; David Tamg ; CP Hung, “Solder joint reliability analysis for large size WLCSP,” International Conference on Electronics Packaging (ICEP), Yamagata, Japan, 2017 |
2022-01-01 |
| 11 |
研討會論文 |
Wei-Hong Lai ; Shao-Chen Yen ; Hsin-Chih Shih ; Meng-Kai Shih ; David Tarng ; Chih-Pin Hung, “Reliability analysis of SiP module board level bending test,” International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Mie, Japan, 2018. |
2022-01-01 |
| 12 |
研討會論文 |
Dao-Long Chen ; Po-Hsien Sung ; Wei-Jie Yin ; Meng-Kai Shih ; David Tarng ; Chih-Pin Hung, “Mechanical characterization comparison as flip-chip package to fan-out package,” International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Mie, Japan, 2018. |
2022-01-01 |
| 13 |
研討會論文 |
Meng-Kai Shih ; Ryan Chen ; PeterBS Chen ; Ying-Chih Lee ; KarenYU Chen ; Ian Hu ; Tang-Yuan Chen ; Lung Tsai ; Eatice Chen ; Eddie Tsai ; David Tarng ; CP Hung, “Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-Out Chip Last Packages,” IEEE 68th Electronic Components and Technology Conference (ECTC) , San Diego, USA, 2018. |
2022-01-01 |
| 14 |
研討會論文 |
Huang Hung-Hsien ; Cheng-Yu Tsai ; Jung-Che Tsai ; Meng-Kai Shih ; David Tang ; CP Hung, “From Package to System Thermal Characterization and Design of High Power 2.5-D IC,” International Conference on Electronics Packaging (ICEP), Niigata, Japan, 2019. |
2022-01-01 |
| 15 |
研討會論文 |
Chan-Yuan Liu ; Jason Chien ; Yu-Chou Tseng ; Kuo-Hsien Liao ; Alex Chan ; Dao-Long Chen ; Meng-Kai Shih ; Mark Gerber, “Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding,” IEEE 69th Electronic Components and Technology Conference (ECTC) , Las Vegas, USA, 2019. |
2022-01-01 |
| 16 |
研討會論文 |
Dao-Long Chen ; Ian Hu ; KarenYU Chen ; Meng-Kai Shih ; David Tarng ; Dinos Huang ; JY On, “Material and Structure Design Optimization for Panel-Level Fan-Out Packaging,” IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, USA, 2019. |
2022-01-01 |
| 17 |
期刊論文 |
D. S. Liu, M. K. Shih and W. H. Huang, “Measurement and Analysis of Wafer Probe Testing Contact Resistance”, Microelectronics Reliability, Vol. 47, Issue 7, PP. 1086-1094, 2006. （IF=1.483, SCI） |
2022-01-01 |
| 18 |
期刊論文 |
D. S. Liu, M. K. Shih and S. M. Liu, “EXPERIMENTAL AIDED PERFORMANCE EVALUATION METHODS FOR WAFER PROBE TEST”, EXPERIMENTAL TECHNIQUES, Vol. 30, Issue 5, PP. 23-27, 2006.（IF=0.779, SCI） |
2022-01-01 |
| 19 |
期刊論文 |
D.S. Liu and M.K. Shih, “Experimental method and FE simulation model for evaluation of wafer probing parameters,” Microelectronics Journal, v37, issue:9, p 871-883, 2006.（IF=1.284, SCI） |
2022-01-01 |
| 20 |
期刊論文 |
D.S. Liu and M.K. Shih, “An Experimental and Numerical Investigation Into Multilayer Probe Card Layout Design,” IEEE Transactions on Electronics Packaging Manufacturing, v29, issue:3, p 163-171, 2006. （IF=1.336, SCI） |
2022-01-01 |
